AuSn
How does AuSn alloy and flux impact the reliability of solder paste?
When looking at the reliability of AuSn solder paste, you need to take a couple of things into consideration, the post reflow alloy composition (off-e...
Why is AuSn powder size important for solder paste application?
Today's electronics continue to get smaller and smaller, so the traditional type 3 (-200/+325) mesh size might be too large for new scale-ups. Thi...
The Benefits of Indium Corporation Gold/Tin Solder Paste
Indium Corporation’s gold/tin solder paste gives manufacturers the versatility to produce high volumes of scaled-up product on demand without co...
The Impact of Bonding Surface Plating on the Reliability of a AuSn (Gold-Tin) Solder Joint
Performing die-attach using AuSn solder alloy preforms against gold plating? You may need an off-eutectic solder alloy to compensate for the Au that i...
Soldering 80Au/20Sn with Specialized Fluxes & Formic Acid
Not all fluxes can handle the high processing temperature required for Au/Sn solder preforms....
Fluxless Soldering of 80Au/20Sn with Forming Gas/Inert Atmosphere
Soldering without flux is generally regarded as difficult if not impossible. Yet a fluxless process is routinely done with 80Au/Sn ribbon and preforms...
Au/Sn – Different Solder Forms
Au/Sn is available in all the forms you would expect from conventional solder alloys. ...
Gold/Tin Solder Alloy: Applications & Alloy Composition Choices
Typically, applications that use gold-tin solders are structural or die-attach. Structural applications make use of the alloy’s high strength, w...
80Au20Sn: Superior Physical Properties
In my previous post we saw that 80Au/20Sn eutectic alloy performs as both a solder or a braze. This is due to its unique and valuable properties. Let&...